Blank Cover Image

CALCULATION OF STRESS GRADIENTS IN THIN Al-0.5% Cu/Ti LINES FROM STRAIN GRADIENTS MEASURED AS A FUNCTION OF TEMPERATURE USING GRAZING INCIDENCE X-RAY SCATTERING

著者名:
掲載資料名:
Thin films : stresses and mechanical properties III : symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
239
発行年:
1992
開始ページ:
233
終了ページ:
238
総ページ数:
6
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991330 [1558991336]
言語:
英語
請求記号:
M23500/239
資料種別:
国際会議録

類似資料:

1 国際会議録 DETERMINATION OF STRAIN DISTRIBUTIONS IN ALUMINUM THIN FILMS AS A FUNCTION OF TEMPERATURE BY THE USE OF SYNCHROTRON GRAZING INCIDENCE X-RAY SCATTERING

Venkatraman, Ramnath, Besser, Paul R., Brennan, Sean, Bravman, John C.

Materials Research Society
7 国際会議録 STRAIN RELAXATION AND IN-SITU OBSERVATION OF VOIDING IN PASSIVATED ALUMINUM ALLOY LINES

Besser, Paul R., Marieb, Thomas N., Bravman, John C.

MRS - Materials Research Society
2 国際会議録 X-RAY OBSERVATION OF STRESS GRADIENTS AND PRECIPITATION IN PASSIVATED A1-0.5%Cu FILMS

Besser, Paul R., Brennan, Sean, Bravman, John C.

MRS - Materials Research Society
8 国際会議録 AN ANODIC PROCESS FOR THE DETERMINATION OF GRAIN BOUNDARY AND FILM THICKNESS STRENGTHENING EFFECTS IN ALUMINUM FILMS ON OXIDIZED SILICON

Venkatraman, Ramnath, Bravman, John C.

Materials Research Society
3 国際会議録 STRESS GRADIENT AND RELAXATION MEASUREMENTS IN Al AND OXYGEN-IMPLANTED Al FILMS

Besser, Paul R., Bader, Stefan, Venkatraman, Ramnath, Bravman, John C.

MRS - Materials Research Society
9 国際会議録 CRYSTALLITE DIMENSIONS AND STRAIN IN POLY-Si AND Ti-SILICIDE THIN FILMS MEASURED WITH GRAZING INCIDENCE X-RAY DIFFRACTION

Leiberich, A., Roy, P. K.

Materials Research Society
4 国際会議録 STRESS GRADIENT AND RELAXATION MEASUREMENTS IN Al AND OXYGEN-IMPLANTED Al FILLMS

Besser, Paul R., Bader, Stefan, Venkatraman, Ramnath, Bravman, John C.

MRS - Materials Research Society
10 国際会議録 In Situ X-ray Microbeam Cu Fluorescence and Strain Measurements on Al(0.5 at.% Cu) Conductor Lines During Electromigration

Kao, H-K., Cargill, G. S., III., Hwang, K. J., Ho, A. C., Wang, P-C., Hu, C-K.

MRS - Materials Research Society
5 国際会議録 X-RAY DETERMINATION AND FINITE-ELEMENT MODELING OF STRESS IN PASSIVATED Al-0.5%Cu LINES DURING THERMAL CYCLING

Besser, Paul R., Mack, Anne Sauter, Fraser, David, Bravman, John C.

MRS - Materials Research Society
11 国際会議録 Stress Gradients Observed in Cu Thin Films Induced by Capping Layers

Conal E. Murray, Paul R. Besser, Christian Witt, Jean L. Jordan-Sweet

Materials Research Society
6 国際会議録 STRAIN RELAXATION AND IN-SITU OBSERVATION OF VOIDING IN PASSIVATED ALUMINUM ALLOY LINES

Besser, Paul R., Marieb, Thomas N., Bravman, John C.

MRS - Materials Research Society
12 国際会議録 IN-SITU OBSERVATION OF THE INITIAL STAGES OF Co (0001) EPITAXY ON Pt (111) USING GRAZING INCIDENCE X-RAY DIFFRACTION

Bain, James A., Clemens, Bruce M., Brennan, Sean

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12