EVALUATION ON ELECTROMIGRATION AND STRESSMIGRATION OF METAL INTERCONNECTIONS BY HARDNESS MEASUREMENTS
- 著者名:
Nakagawa, T. Miyatake, H. Maeda, T. Kuroda, K. Tokushige, N. Inoue, R. Kudo, J. Ashida, T. - 掲載資料名:
- Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 226
- 発行年:
- 1991
- 開始ページ:
- 425
- 終了ページ:
- 432
- 総ページ数:
- 8
- 出版情報:
- Pittsburgh, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558991200 [1558991204]
- 言語:
- 英語
- 請求記号:
- M23500/226
- 資料種別:
- 国際会議録
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