Blank Cover Image

*STRESS AND ELECTROMIGRATION IN THIN FILM METALLISATION

著者名:
Ross, R. A.  
掲載資料名:
Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
225
発行年:
1991
開始ページ:
35
終了ページ:
46
総ページ数:
12
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991194 [1558991190]
言語:
英語
請求記号:
M23500/225
資料種別:
国際会議録

類似資料:

Lloyd, J. R.

Materials Research Society

Gungor, M. R., Gray, L. J., Zhou, S. J., Maroudas, D.

MRS - Materials Research Society

Ross, C. A., Evetts, J. E.

Materials Research Society

Katsman, A., Levin, L.

MRS - Materials Research Society

Ross, C. A., Ranjan, R., Chang, J.

MRS - Materials Research Society

Lloyd, J. R.

Materials Research Society

Ross, C. A.

MRS - Materials Research Society

Ross, C.A., Malmhaell, R.

Electrochemical Society

Pasco, R. W., Felton, L. E., Schwarz, J. A.

North-Holland

Mockl, U. E., Lloyd, J. R., Arzt, E.

MRS - Materials Research Society

6 国際会議録 Stress and Electromigration

Lloyd, J. R.

MRS - Materials Research Society

Lloyd, J. R., Smith, P. M., Prokop, G. S.

North-Holland

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12