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EFFECT OF OXYGEN EXPOSURE AND DEPOSITION ENVIRONMENT ON THERMAL STABILITY OF Ta BARRIERS TO Cu PENETRATION

著者名:
Bojarczuk, N.A.
Clevenger, L.A.
Holloway, K.
Harper, J.M.E.
Cabral, C.
Schad, R.G.
Stolt, L.
さらに 2 件
掲載資料名:
Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
203
発行年:
1991
開始ページ:
387
終了ページ:
394
総ページ数:
8
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558990951 [155899095X]
言語:
英語
請求記号:
M23500/203
資料種別:
国際会議録

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