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PHASE STABILITY AND MECHANICAL BEHAVIOR OF TERNARY BISMUTH-LEAD-TIN SOLDERS

著者名:
掲載資料名:
Advanced electronic packaging materials : symposium held November 27-29, 1989, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
167
発行年:
1990
開始ページ:
359
終了ページ:
364
総ページ数:
6
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558990555 [1558990550]
言語:
英語
請求記号:
M23500/167
資料種別:
国際会議録

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