X-RAY DIFFRACTION AND TEM STUDIES OF THE DELAMINATION OF COPPER THIN FILMS FROM GLASS AND SILICA SUBSTRATES

X-RAY DIFFRACTION AND TEM STUDIES OF THE DELAMINATION OF COPPER THIN FILMS FROM GLASS AND SILICA SUBSTRATES

著者名:

掲載資料名:

Advanced electronic packaging materials : symposium held November 27-29, 1989, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

167

発行年:

1990

開始ページ:

329

終了ページ:

334

総ページ数:

6

出版情報:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558990555 [1558990550]

言語:

英語

請求記号:

M23500/167

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015651
シリーズID:	PA00000011
会議名:	Symposium on advanced electronic packaging materials
回次:	1989
会議開催地:	Boston, MA, USA
会議開催年:	1989.11.27-1989.1129

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