THE ASPECTS OF THERMAL ANNEAL TO INTRINSIC STRESS AND MICROSTRUCTURE OF MULTILAYER THIN FILNS
- 著者名:
- 掲載資料名:
- Electronic packaging materials science IV : symposium held April 24-28, 1989, San Diego, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 154
- 発行年:
- 1989
- 開始ページ:
- 335
- 終了ページ:
- 342
- 総ページ数:
- 8
- 出版情報:
- Pittsburgh, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558990272 [1558990275]
- 言語:
- 英語
- 請求記号:
- M23500/154
- 資料種別:
- 国際会議録
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1
国際会議録
THE ASPECTS OF THERMAL ANNEAL TO INTRINSIC STRESS AND MICROSTRUCTURE OF MULTILAYER THIN FILMS
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