Blank Cover Image

REACTION KINETICS, STRESS AND MICROSTRUCTURE IN TITANIUM-COPPER-TITANIUM THIN FILMS

著者名:
掲載資料名:
Thin films : interfaces and phenomena : symposium held December 2-6, 1985, Boston, Massachusetts, USA
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
54
発行年:
1985
開始ページ:
153
終了ページ:
158
総ページ数:
6
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9780931837197 [0931837197]
言語:
英語
請求記号:
M23500/54
資料種別:
国際会議録

類似資料:

1 国際会議録 EFFECTS OF HYDROGEN ON THERMAL STRESS IN LAYERED STRUCTURE OF Ti AND Ti (Al) THIN FILMS

Hu,C.-K., Ho, P.S., Gupta, D., Chen, S.T.

Materials Research Society
7 国際会議録 Titanium Oxide CVD from Titanium (IV) Nitrate and Titanium (IV) Isopropoxide: Growth Kinetics, Film Morphology and Precursor Specific Effects

Taylor, C.J., Gilmer, D., Gladfelter, W. L., Campbell, S., Roberts, J.T.

Electrochemical Society
2 国際会議録 THE MICROSTRUCTURE OF COPPER FILMS DEPOSITED BY E-BEAL EVAPORATION ONTO THIN POLYIMIDE FILMS

Wetzel, J. T., Smith, D. A,., Appleby-Mougham, G.

Materials Research Society
8 国際会議録 Effects of seeding over the microstructure and stresses of diamond thin films

Gupta, S., Morell, G., Katiyar, R. S., Gilbert, D. R., Singh, R. K.

MRS-Materials Research Society
3 国際会議録 Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

Harper, J. M. E., Cabral, C., Jr., Andricacos, P. C., Gignac, L., Noyan, I. C., Rodbell, K. P., Hu, C. K.

MRS - Materials Research Society
9 国際会議録 Stress Voiding and Electromigration Failure in Multilevel Interconnect Metallization

Ho, P.S., Anderson, S.G.H., Yeo, I.S., Hu, C.K.

Electrochemical Society
4 国際会議録 Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

Cabral, C., Gignac, L., Harper, J. N. E., Hu, C. K., Noyan, I. C., ricacos, P. C., Rodbell, K. P.

Materials Research Society
10 国際会議録 Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films

R. Vayrette, C. Rivero, S. Blayac, K. Inal

Trans Tech Publications
5 国際会議録 MICROSTRUCTURE AND KINETICS OF THE INTERFACE REACTION BETWEEN TITANIUM THIN FILMS AND (112) SAPPHIRE SUBSTRATES

Selverian, J.H., Ohuchi, F.S., Notis, M.R.

Materials Research Society
11 国際会議録 Characterisation of the Oxidation Kinetics of Thin, Low Temperature, Electroless Plated Copper Films

Beechinor, J. T., O'Reilly, M., Patterson, J. C., Lynch, S., Lafferty, E., Kelly, P. V., Crean, G. M.

MRS - Materials Research Society
6 国際会議録 Stress, Microstructure And Temperature Stability Of Reactive Sputter Deposited WNx Thin Films

Leedy, K.D., O'Keefe, M.J., Wilson, J.G., Osterday, R., Grant, J.T.

Materials Research Society
12 国際会議録 A Three-Phase Model For The Structure Of Porous Thin Films Determined By X-ray Reflectivity And Small-Angle Neutron Scattering

Wu, W., Lin, E.K., Jin, C., Wetzel, J.T.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12