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DEPENDENCE OF Cu/Sn AND Cu/60Sn40Pb SOLDER JOINT STRENGTH ON DIFFUSION CONTROLLED GROWTH OF Cu3Sn AND Cu6Sn5

著者名:
掲載資料名:
Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
40
発行年:
1985
開始ページ:
129
終了ページ:
138
総ページ数:
10
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9780931837050 [0931837057]
言語:
英語
請求記号:
M23500/40
資料種別:
国際会議録

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