New SOI devices transferred onto fused silica by direct wafer bonding

New SOI devices transferred onto fused silica by direct wafer bonding

著者名:

Lagahe-Blanchard, C.

du Port de Poncharra, J.

Moriceau, H.

さらに 3 件

掲載資料名:

Silicon-on-insulator technology and devices XII : proceedings of the international symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2005-03

発行年:

2005

開始ページ:

237

終了ページ:

242

総ページ数:

6

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774611 [1566774616]

言語:

英語

請求記号:

E23400/200503

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015411
シリーズID:	PA00000028
会議名:	International Symposium on Silicon-on-Insulator Technology and Devices ; Meeting of the Electrochemical Society
回次:	12th ; 207th
会議開催地:	Quebec City, Canada
会議開催年:	2005.05.15-2005.05.20

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2 国際会議録 New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers B. Aspar, C. Lagahe-Blanchard, N. Sousbie, J. Margail, H. Moriceau Electrochemical Society	8 国際会議録 Recent Results on Advanced Molecular Wafer Bonding Technology for 3D Integration on Silicon di Cioccio, L., Biasse, B., Kostrzewa, M., Zussy, M., Dechamp, J., Charlet, B., Vinet, M., Fedeli, J.M., Poiroux, T., … Electrochemical Society
3 国際会議録 Hydrogen and Helium Implantation to Achieve Layer Transfer Lagahe-Blanchard, C., Sousbie, N., Sartori, S., Moriceau, H., Soubie, A., Aspar, B., Nguyen, P., Blondeau, B. Electrochemical Society	9 国際会議録 Detailed Characterization of Wafer Bonding Mechanisms Maleville, C., Rayssac, O., Moriceau, H., Blasse, B., Baroux, L., Aspar, B., Bruel, M. Electrochemical Society
4 国際会議録 Single-Crystal Semiconductor Layer Delamination and Transfer Through Hydrogen Implantation Bruel, M., Aspar, B., Moriceau, H., Jalaguier, E., Lagahe, C. Electrochemical Society	10 国際会議録 Unibond SOI wafers achieved by Smart-Cut process Bruel, M., Aspar, B., Maleville, C., Moriceau, H., Auberton-Herve, A.J., Barge, T. Electrochemical Society
5 国際会議録 Overview on Some Recent Advances in Wafer Bonding Technologies Moriceau, H., Fournel, F., Rayssac, O., Cartier, A.M., Morales, C., Pocas, S., Zussy, M., Jalaguier, E., Biasse, B., … Electrochemical Society	11 国際会議録 Unibond SOI Wafers Achieved by Smart-Cut Process Bruel, M., Aspar, B., Maleville, C., Moriceau, H., Auberton-Herve, A.J., Barge, T. Electrochemical Society
6 国際会議録 Characterisation of SOI substrates: application to recent SIMOX and UNIBOND wafers Aspar, B, Moriceau, H, Auberton-Herve, A J Electrochemical Society	12 国際会議録 Smart-Cut(R): The Basic Fabrication Process for Unibond(R) SOI Wafers Auberton-Herve, A. J., Barge, T., Metral, F., Bruel, M., Aspar, B., Meleville, C., Moriceau, H., Poumeyrol, T. MRS - Materials Research Society

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