Cross-Sectional Crystallographic Analysis of Copper Electrodeposits for ULSI Metallization by EBSD

Cross-Sectional Crystallographic Analysis of Copper Electrodeposits for ULSI Metallization by EBSD

著者名:

掲載資料名:

Electrochemical processes in ULSI and MEMS : proceedings of the international symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2004-17

発行年:

2005

開始ページ:

108

終了ページ:

116

総ページ数:

9

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774727 [1566774721]

言語:

英語

請求記号:

E23400/200417

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015410
シリーズID:	PA00000028
会議名:	Symposium on Electrochemical Processes in ULSI and MEMS ; Spring Meeting of the Electrochemical Society
回次:	2004 ; 205th
会議開催地:	San Antonio, TX, USA
会議開催年:	2004.00.00

類似資料:

1 国際会議録 Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI Lee, H.-J., Lee, D.N. Trans Tech Publications	7 国際会議録 Characterization of Cold Drawn Gold bonding Wire with EBSD Cho, J.-H., Cho, J.S., Moon, J.T., Lee, J., Cho, Y.H., Rollett, A.D., Oh, K.H. Trans Tech Publications
2 国際会議録 Microtexture Measurement of Copper Damascene Line with EBSD Kim, D.-I., Paik, J.-M., Joo, Y.-C., Oh, K.H., Lee, H.-C., Dicks, K. Trans Tech Publications	8 国際会議録 Recrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation Kang, S.Y., Lee, D.N. Trans Tech Publications
3 国際会議録 EBSD Analysis of Grain Boundary Characteristics of Abnormally Grain Grown Alumina Kim, D.-I., Lee, J.-H., Kim, Y.-W., Oh, K.H., Lee, H.-C. Trans Tech Publications	9 国際会議録 Texture Analysis of Copper Bonding Wire Baeck, S.M., Park, K.K., Ha, H., Oh, Y., Park, Y., Moon, J.T., Lee, J., Oh, K.H. Trans Tech Publications
4 国際会議録 Thermomechanical Treatment for Enhancing Deep Drawability of Copper-Bearing Bake Hardening Steel Y.M. Koo, K.H. Oh, D.N. Lee Trans Tech Publications	10 国際会議録 Evolution of Textures and Microstructures in Low-Reduction Rolled and Annealed Low-Carbon Steels K.H. Oh, Y.M. Koo, D.N. Lee Trans Tech Publications
5 国際会議録 Plastic Strain Ratios of Fe and Ni Electrodeposits Shin, H.-J., Lee, D.N. Trans Tech Publications	11 国際会議録 Texture and Related Phenomena of Copper Electrodeposits Lee, D. N. MRS - Materials Research Society
6 国際会議録 Derivation of Yield Criteria of Cubic Metals from Schmid's Law Jeong,H-T., Lee,D.N., Oh,K.H. Trans Tech Publications	12 国際会議録 Evolution of Crystallographic Texture in Pure Iron and Commercial Steels by γ to α Transformation J.K. Sung, D.N. Lee Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12