Thermal-Microwave Hybrid SOI Materials Technology
- 著者名:
Cheng, J.T. Huang, C.-H. Hsu, Y.-K. Chang, C.-L. Wang, H.-W. Gan, G. Lee, S.-L. Lee, T.-H. - 掲載資料名:
- Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2005-02
- 発行年:
- 2005
- 開始ページ:
- 414
- 終了ページ:
- 423
- 総ページ数:
- 10
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774604 [1566774608]
- 言語:
- 英語
- 請求記号:
- E23400/200502
- 資料種別:
- 国際会議録
類似資料:
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
Materials Research Society |
SPIE - The International Society of Optical Engineering |
Electrochemical Society |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
Electrochemical Society |