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Fabrication of SOI Substrates with Buried Silicide Layers for BiCMOS Applications

著者名:
Wiemer, M.
Zimmermann, S.
Zhao, Q.T.
Trui, B.
Kaufmann, C.
Mantl, S.
Dudek, V.
Gessner, T.
さらに 3 件
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2005-02
発行年:
2005
開始ページ:
303
終了ページ:
310
総ページ数:
8
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
言語:
英語
請求記号:
E23400/200502
資料種別:
国際会議録

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