SOI Wafers with Buried Cavities

SOI Wafers with Buried Cavities

著者名:

Suni, T.

掲載資料名:

Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2005-02

発行年:

2005

開始ページ:

216

終了ページ:

225

総ページ数:

10

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774604 [1566774608]

言語:

英語

請求記号:

E23400/200502

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015387
シリーズID:	PA00000028
会議名:	International Symposium on Semiconductor Wafer Bonding
回次:	8th
会議開催地:	Quebec City, Canada
会議開催年:	2005.05.15-2005.05.20

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2 国際会議録 Direct Bonding of Thick Film Polysilicon to Glass Substrates Luoto, H., Suni, T., Henttinen, K., Kulawski, M. Electrochemical Society	8 国際会議録 Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO2 Suni, T., Henttinen, K., Suni, I., Maekinen, J. Electrochemical Society
3 国際会議録 Direct Bonding of Oxidized Cavity Wafers M.O. Palokangas, J. Dekker, K. Henttinen, J. Mäkinen Electrochemical Society	9 国際会議録 Characterization of Bonded Interface by HF Etching Method Suni, T., Kiihamaeki, J., Henttinen, K., Suni, I, Maekinen, J. Electrochemical Society
4 国際会議録 Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates Kulawski, Martin, Luoto, Hannu, Henttinen, Kimmo, Suni, Tommi, Weimar, Frauke, Makinen, Jari Materials Research Society	10 国際会議録 Effect of Buried Oxide on Reliability of Thin-Film SOI nMOSFETs Kim, H-K, Lee, J-W, Lee, W-H, Oh, M-R, Koh, Y-H Electrochemical Society
5 国際会議録 Advances in the CMP Process on Fixed Abrasive Pads for the Polishing of SOI-Substrates With High Degree of Flatness Kulawski, Martin, Luoto, Hannu, Henttinen, Kimmo, Suni, Ilkka, Weimar, Franke, Makinen, Jari Materials Research Society	11 国際会議録 Through-Wafer Polysilicon Interconnect Fabrication with In-Situ Boron Doping Luusua, Ismo, Henttinen, Kimmo, Pekko, Panu, Vehmas, Tapani, Luoto, Hannu Materials Research Society
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