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Low Temperature Integration of CdZnTe(211)B/Si(100) by Wafer Bonding

著者名:
Huang, J.
Cha, D.K.
Kaleczyc, A.
Dinan, J.H.
Carpenter, R.W.
Kim, M.J.
さらに 1 件
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2005-02
発行年:
2005
開始ページ:
128
終了ページ:
133
総ページ数:
6
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
言語:
英語
請求記号:
E23400/200502
資料種別:
国際会議録

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