Transfer of Two-Inch GaN Film by the Smart CutTM Technology | 東京工業大学附属図書館文献データベース

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Transfer of Two-Inch GaN Film by the Smart CutTM Technology

著者名:

さらに 9 件

掲載資料名:

Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2005-02

発行年:

2005

開始ページ:

119

終了ページ:

127

総ページ数:

9

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774604 [1566774608]

言語:

英語

請求記号:

E23400/200502

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015387
シリーズID:	PA00000028
会議名:	International Symposium on Semiconductor Wafer Bonding
回次:	8th
会議開催地:	Quebec City, Canada
会議開催年:	2005.05.15-2005.05.20

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2 国際会議録 Germanium-on-Insulator (GeOI) Structure Realized by the Smart CutTM Technology Letertre, F., Deguet, C., Richtarch, C., Faure, B., Hartmann, J.M., Chieu, F., Beaumont, A., Dechamp, J., Morales, C., … Materials Research Society	8 国際会議録 Recent Results on Advanced Molecular Wafer Bonding Technology for 3D Integration on Silicon di Cioccio, L., Biasse, B., Kostrzewa, M., Zussy, M., Dechamp, J., Charlet, B., Vinet, M., Fedeli, J.M., Poiroux, T., … Electrochemical Society
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