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Surface Plasma Activation Before Direct Wafer Bonding: A Short Review and Recent Results

著者名:
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2005-02
発行年:
2005
開始ページ:
34
終了ページ:
49
総ページ数:
16
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774604 [1566774608]
言語:
英語
請求記号:
E23400/200502
資料種別:
国際会議録

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