Thermal Processing and Failure Due to Current Driven Mass Transport of Metallic Thin Film Interconnects
- 著者名:
- Gray, Leonard J. ( Oak Ridge National Laboratory, Oak Ridge, TN )
- Gungor, Rauf ( University of California at Santa Barbara, Santa Barbara, CA )
- Maroudas, Dimitrios ( University of California at Santa Barbara, Santa Barbara, CA )
- 掲載資料名:
- AIChE 1998 ANNUAL MEETING
- シリーズ名:
- AIChE meeting [papers]
- シリーズ巻号:
- 1998
- 発行年:
- 1998
- ペーパー番号:
- 208b
- 総ページ数:
- 4
- 出版情報:
- New York: American Institute of Chemical Engineers
- 言語:
- 英語
- 請求記号:
- A08000
- 資料種別:
- 国際会議録
類似資料:
|
MRS - Materials Research Society |
American Institute of Chemical Engineers |
|
American Institute of Chemical Engineers |
American Institute of Chemical Engineers |
|
American Institute of Chemical Engineers |
American Institute of Chemical Engineers |
|
Materials Research Society |
Materials Research Society |
|
American Institute of Chemical Engineers |
American Institute of Chemical Engineers |
|
6
国際会議録
564c. Effects of Elastic Stress on Electromigration-Driven Void Dynamics in Metallic Thin Films
American Institute of Chemical Engineers |
12
国際会議録
Electromechanically-Driven Complex Morphological Evolution of Void Surfaces in Metallic Thin Films
American Institute of Chemical Engineers |