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Bonding and deep RIE: a powerful combination for high-aspect-ratio sensors and actuators

著者名:
Hiller, K. ( Chemnitz Univ. of Technology (Germany) )
Kuchler, M. ( Fraunhofer Institute for Reliability and Microintegration (Germany) )
Billep, D. ( Chemnitz Univ. of Technology (Germany) )
Schroter, B. ( Chemnitz Univ. of Technology (Germany) )
Dienel, M. ( Chemnitz Univ. of Technology (Germany) )
Scheibner, D. ( Chemnitz Univ. of Technology (Germany) )
Gessner, T. ( Chemnitz Univ. of Technology (Germany) and Fraunhofer Institute for Reliability and Microintegration (Germany) )
さらに 2 件
掲載資料名:
Micromachining and Microfabrication Process Technology X
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
5715
発行年:
2005
開始ページ:
80
終了ページ:
91
総ページ数:
12
出版情報:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456892 [0819456896]
言語:
英語
請求記号:
P63600/5715
資料種別:
国際会議録

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