Thermo-mechanical damage analysis of through-hole formation by laser drilling for 3D opto-electronic device assembly
- 著者名:
- Yasuda, K. ( Osaka Univ. (Japan) )
- Kobayashi, M. ( Osaka Univ. (Japan) )
- Fujimoto, K. ( Osaka Univ. (Japan) )
- 掲載資料名:
- Fifth International Symposium on Laser Precision Microfabrication : 11-14 May, 2004, Nara, Japan
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 5662
- 発行年:
- 2004
- 開始ページ:
- 621
- 終了ページ:
- 626
- 総ページ数:
- 6
- 出版情報:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819456236 [0819456233]
- 言語:
- 英語
- 請求記号:
- P63600/5662
- 資料種別:
- 国際会議録
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