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High-power diode laser bonding process between tape-carrier package and a glass panel with anisotropic conductive film

著者名:
Nam, G. -J. ( Institute for Advanced Engineering(South Korea) )
Seo, M. -H. ( Institute for Advanced Engineering(South Korea) )
Hong, Y. -S. ( Institute for Advanced Engineering(South Korea) )
Lee, S. -U. ( Institute for Advanced Engineering(South Korea) )
Moon, S. -W. ( Institute for Advanced Engineering(South Korea) )
Ryu, K. -H. ( Univ. of Foreign Study(South Korea) )
Kwon, N. -I. ( Univ. of Foreign Study(South Korea) )
Kwak, N. -H. ( Jettech Ltd. (South Korea) )
さらに 3 件
掲載資料名:
Fifth International Symposium on Laser Precision Microfabrication : 11-14 May, 2004, Nara, Japan
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
5662
発行年:
2004
開始ページ:
319
終了ページ:
324
総ページ数:
6
出版情報:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456236 [0819456233]
言語:
英語
請求記号:
P63600/5662
資料種別:
国際会議録

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