Device analysis: a way to reduce patterning cost at mask and wafer level?

Device analysis: a way to reduce patterning cost at mask and wafer level?

著者名:

Balasinski, A. P. ( Cypress Semiconductor Corp. (USA) )
Driessen, F. A. ( Takumi Technology (Netherlands) )

掲載資料名:

24th Annual BACUS Symposium on Photomask Technology

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

5567

発行年:

2004

開始ページ:

147

終了ページ:

154

総ページ数:

8

出版情報:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819455130 [081945513X]

言語:

英語

請求記号:

P63600/5567-1

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014769
シリーズID:	PA00000029
会議名:	SPIE Photomask Technology : Annual BACUS Symposium on Photomask Technology
回次:	2004 : 24th
会議開催地:	Monterey, California, USA
会議開催年:	2004.09.14-2004.09.17

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