The Effect Of The Microstructure Of Diffusion Barriers On The Palladium Activation For Electroless Copper Deposition

The Effect Of The Microstructure Of Diffusion Barriers On The Palladium Activation For Electroless Copper Deposition

著者名:

掲載資料名:

Silicon materials - processing characterization and reliability : symposium held April 1-5, 2002, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

716

発行年:

2002

開始ページ:

543

終了ページ:

548

総ページ数:

6

出版情報:

Warrendale: Materials Research Society

ISSN:

02729172

ISBN:

9781558996526 [1558996524]

言語:

英語

請求記号:

M23500/716

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014589
シリーズID:	PA00000011
会議名:	Symposium on silicon materials - processing characterization and reliability
回次:	2002
会議開催地:	San Francisco, CA, USA
会議開催年:	2002.04.01-2002.04.05

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