Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration

Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration

著者名:

Kwon, Y.

掲載資料名:

Polymer interfaces and thin films : symposium held November 26-30, 2001, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

710

発行年:

2002

開始ページ:

231

終了ページ:

238

総ページ数:

8

出版情報:

Warrendale, PA: Materials Research Society

ISSN:

02729172

ISBN:

9781558996465 [155899646X]

言語:

英語

請求記号:

M23500/710

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014584
シリーズID:	PA00000011
会議名:	Symposium on polymer interfaces and thin films
回次:	2001
会議開催地:	Boston, MA, USA
会議開催年:	2001.11.26-2001.11.30

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1 国際会議録 Wafer Bonding Using Low-k Dielectrics aa Bonding Glue in Three-Dimensional Integration Kwon, Y., Lu, J.-Q., Gutmann, R.J., Kraft, R.P., McDonald, J., Cale, T.S. Electrochemical Society	7 国際会議録 Bonding Characterization of Oxidized PDMS Thin Films McMahon, J.J., Kwon, Y., Lu, J.-Q., Cale, T.S., Gutmann, R.J. Materials Research Society
2 国際会議録 Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects Lu, J.-Q., Jindal, A., Kwon, Y., McMahon, J.J., Lee, K.-W., Kraft, R.P., Altemus, B., Cheng, D., Eisenbraun, E., Cale, … Electrochemical Society	8 国際会議録 Dielectric Glue Wafer Bonding for 3D ICs Kwon, Y., Jindal, A., McMahon, J. J., Lu, J. -Q., Gutmann, R. J., Cale, T. S. Materials Research Society
3 国際会議録 Dielectric Glue Wafer Bonding and Bonded Wafer Thinning for Wafer-Level 3D Integration Lu, J.-Q., Kwon, Y., Jindal, A., McMahon, J.J., Cale, T.S., Gutmann, R.J. Electrochemical Society	9 国際会議録 Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding. Niklaus, F., Kumar, R.J., McMahon, J.J., Yu, J., Matthias, T., Wimplinger, M., Lindner, P., Lu, J.-Q., Cale, T.S., … Materials Research Society
4 国際会議録 Wafer Bonding and Thinning for 3D-IC Fabrication Kwon, Y., Jindal, A., McMahon, J.J., Cale, T.S., Gutmann, R.J., Lu, J-Q. Electrochemical Society	10 国際会議録 Planarization Issues in Wafer-Level Three-Dimensional (3D) Integration Lu, J.-Q., Rajagopalan, G., Gupta, M., Cale, T.S., Gutmann, R.J. Materials Research Society
5 国際会議録 3D System-on-a-Chip Using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects Lu, J.-Q., Jindal, A., Kwon, Y., McMahon, J.J., Lee, K-W., Craft, R.P., Altemus, B., Cheng, D., Eisenbraum, E., Cale, … Electrochemical Society	11 国際会議録 Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy Wimplinger, M., Lu, J.-Q., Yu, J., Kwon, Y., Matthias, T., Cale, T.S., Gutmann, R.J. Materials Research Society
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