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A Predictive Model for Controlling Wafer Level Polish Rate Uniformity in Oxide CMP

著者名:
掲載資料名:
Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
867
発行年:
2005
開始ページ:
241
終了ページ:
246
総ページ数:
6
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998209 [1558998209]
言語:
英語
請求記号:
M23500/867
資料種別:
国際会議録

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