Investigating the Effects of Diluting Solutions and Trace Metal Contamination on Aggregation Characteristics of Silica-Based ILD CMP Slurries
- 著者名:
- 掲載資料名:
- Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 867
- 発行年:
- 2005
- 開始ページ:
- 159
- 終了ページ:
- 166
- 総ページ数:
- 8
- 出版情報:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558998209 [1558998209]
- 言語:
- 英語
- 請求記号:
- M23500/867
- 資料種別:
- 国際会議録
類似資料:
Materials Research Society |
Electrochemical Society |
2
国際会議録
Tribological and Removal Rate Characterization of Colloidal vs. Fumed Silica Slurries in ILD CMP
Electrochemical Society |
8
国際会議録
Evaluation of Barrier CMP Slurries and Characterization of ULK Material Properties Shifts Due to CMP
Electrochemical Society |
Electrochemical Society |
MRS - Materials Research Society |
4
国際会議録
Application of Raman Spectroscopy in Cu CMP: In Situ Detection of Chemical Species in the Slurry
Materials Research Society |
Electrochemical Society |
Materials Research Society |
Electrochemical Society |
Materials Research Society |
12
国際会議録
Feasibility of Detecting Barrier Layer to Low-K Transition in Copper CMP Using Raman Spectroscopy
Materials Research Society |