Novel Use of Surfactants in Copper Chemical Mechanical Polishing (CMP)

Novel Use of Surfactants in Copper Chemical Mechanical Polishing (CMP)

著者名:

掲載資料名:

Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

867

発行年:

2005

開始ページ:

41

終了ページ:

46

総ページ数:

6

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558998209 [1558998209]

言語:

英語

請求記号:

M23500/867

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014510
シリーズID:	PA00000011
会議名:	MRS Spring Meeting
回次:	2005
会議開催地:	San Francisco, California, U.S.A.
会議開催年:	2005.03.28-2005.03.31

類似資料:

1 国際会議録 Role of Molecular Structure of Complexing/Chelating Agents in Copper CMP Slurries Patri, Udaya B., Pandija, S., Babu, S.V. Materials Research Society	7 国際会議録 Comparison of Glycine and Citric Acid as Complexing Agents in Copper Chemical-Mechanical Polishing Slurries Gorantla, Venkata, Babu, S. V. Materials Research Society
2 国際会議録 Study of Slurry Composition Transition in a Rotary Copper CMP Process Hegde, Sharath, Patri, Udaya B., Jindal, Anurag, Babu, S. V. Materials Research Society	8 国際会議録 Electrochemical Studies of Copper Chemical Mechanical Polishing Mechanism: Effects of Oxidizer Concentration Lu, J., Garland, J. E., Petite, C. M., Babu, S. V., Roy, D. Materials Research Society
3 国際会議録 Role of Chemicals and Abrasive Particle Properties in Chemical-Mechanical Polishing of Copper and Tantalum Li, Y., Jindal, A., Babu, S.V. Electrochemical Society	9 国際会議録 Slurry Retention and Transport During Chemical-Mechanical Polishing of Copper Jindal, Anurag, Li, Ying, Narayanan, Satish, Bobu, S.V. Materials Research Society
4 国際会議録 Effect of pH on Chemical-Mechanical Polishing of Copper and Tantalum Jindal, Anurag, Li, Ying, Babu, S.V. Materials Research Society	10 国際会議録 Chemical Mechanical Polishing of Copper Using Silica Slurry Kondo, S., Sakuma, N., Homma, Y., Ohashi, N. Electrochemical Society
5 国際会議録 Copper Dissolution and Chemical-Mechanical Polishing in Acidic Media Luo, Q., Campbell, D.R., Babu, S.V. Electrochemical Society	11 国際会議録 Use of Malonic Acid in Chemical Mechanical Polishing (CMP) of Tungsten Zhang, L., Raghavan, S. MRS - Materials Research Society
6 国際会議録 Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy M. K. Keswani, H. Lee, S. Babu, U. Patri, Y. Hong, L. Economikos, M. Goldstein, L. Borucki, A. Philipossian, Y. Zhuang Electrochemical Society	12 国際会議録 Modeling of Polishing Regimes in Chemical Mechanical Polishing Yeruva, Suresh B., Park, Chang-Won, Moudgil, Brij M. Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12