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Three Dimensional Integration with Benzocyclobutene as the Wafer-Bonding Medium

著者名:
掲載資料名:
Materials, integration and packaging issues for high-frequency devices
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
833
発行年:
2004
開始ページ:
87
終了ページ:
92
総ページ数:
6
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997813 [1558997814]
言語:
英語
請求記号:
M23500/833
資料種別:
国際会議録

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