Stressmigration Studies on Dual Damascene Cu/Oxide and Cu/Low-k Interconnects

Stressmigration Studies on Dual Damascene Cu/Oxide and Cu/Low-k Interconnects

著者名:

Baek, Won-Chong

掲載資料名:

Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

812

発行年:

2004

開始ページ:

385

終了ページ:

390

総ページ数:

6

出版情報:

Warrendale: Materials Research Society

ISSN:

02729172

ISBN:

9781558997622 [1558997628]

言語:

英語

請求記号:

M23500/812

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014454
シリーズID:	PA00000011
会議名:	Symposium on materials, technology and reliability for advanced interconnects and low-k dielectrics
回次:	2004
会議開催地:	San Francisco, CA, USA
会議開催年:	2004.04.13-2004.04.15

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