Stress Metrology : The Challenge for the Next Generation of Engineered Wafers

Stress Metrology : The Challenge for the Next Generation of Engineered Wafers

著者名:

Tiberi, Antoine

Paillard, Vincent

Aulnette, Cecile

Daval, Nicolas

Bourdelle, Konstantin K.

掲載資料名:

High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

809

発行年:

2004

開始ページ:

97

終了ページ:

102

総ページ数:

6

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997592 [1558997598]

言語:

英語

請求記号:

M23500/809

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014451
シリーズID:	PA00000011
会議名:	Symposium on high-mobility group
回次:	4th
会議開催地:	San Francisco, CA, USA
会議開催年:	2004.04.13-2004.04.15

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