Integration of III-V Optoelectronic Components on Si Platform

Integration of III-V Optoelectronic Components on Si Platform

著者名:

掲載資料名:

Materials, integration and packaging issues for high-frequency devices

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

783

発行年:

2004

開始ページ:

217

終了ページ:

222

総ページ数:

6

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997219 [1558997210]

言語:

英語

請求記号:

M23500/783

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014440
シリーズID:	PA00000011
会議名:	Materials, Integration and Packaging Issues for High-Frequency Devices : Symposium
回次:	2nd
会議開催地:	Boston, MA, USA
会議開催年:	2004.11.29-2004.12.01

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