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Enhanced Adhesion of Cu Film on a Low-k Material by Using Ti Glue Layer, B Dopant and NU2 Plasma Treatment

著者名:
Ko, Y. K.
Lee, S.
Yang, H. J.
Shim, C.
Jung, D.
Lee, J. G.
さらに 1 件
掲載資料名:
Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
766
発行年:
2003
開始ページ:
497
終了ページ:
502
総ページ数:
6
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997035 [1558997032]
言語:
英語
請求記号:
M23500/766
資料種別:
国際会議録

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