Near-Threshold Electromigration of Damascene Copper on TiN Barrier
- 著者名:
- 掲載資料名:
- Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 766
- 発行年:
- 2003
- 開始ページ:
- 145
- 終了ページ:
- 152
- 総ページ数:
- 8
- 出版情報:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558997035 [1558997032]
- 言語:
- 英語
- 請求記号:
- M23500/766
- 資料種別:
- 国際会議録
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