Microstructure and Stress Analyses of Copper Films Deposited on Biased Substrates by Microwave Plasma-Assisted Sputtering
- 著者名:
- 掲載資料名:
- Surface engineering 2002 - synthesis, characterization and applications : symposium held December 2-5, 2002, Boston, Massachusetts, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 750
- 発行年:
- 2003
- 開始ページ:
- 343
- 終了ページ:
- 348
- 総ページ数:
- 6
- 出版情報:
- Warrendale, Penn: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558996878 [1558996877]
- 言語:
- 英語
- 請求記号:
- M23500/750
- 資料種別:
- 国際会議録
類似資料:
Trans Tech Publications | |
Trans Tech Publications |
Kluwer Academic Publishers |
Materials Research Society |
9
国際会議録
Microstructure and Mechanical Properties of DBC on Sputter Deposited Copper on Alumina Substrate
Trans Tech Publications |
MRS - Materials Research Society |
Kluwer Academic Publishers |
SPIE-The International Society for Optical Engineering |
Trans Tech Publications |
Kluwer Academic Publishers |
12
国際会議録
Stress, Microstructure And Temperature Stability Of Reactive Sputter Deposited WNx Thin Films
Materials Research Society |