Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines

Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines

著者名:

掲載資料名:

Textures of materials : ICOTOM 14 : Proceedings of the 14th International Conference on Textures of Materials, held in Leuven, Belgium, July 11-15, 2005

シリーズ名:

Materials science forum

シリーズ巻号:

495-497(2)

発行年:

2005

開始ページ:

1443

終了ページ:

1448

総ページ数:

6

出版情報:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499755 [087849975X]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014249
シリーズID:	PA00000012
会議名:	International Conference on Textures of Materials : ICOTOM
回次:	14th
会議開催地:	Leuven, Belgium
会議開催年:	2005.07.11-2005.07.15

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2 国際会議録 New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines Mirpuri, K. K., Szpunar, J. A. Trans Tech Publications	8 国際会議録 Texture Investigation in Cu Damascene Interconnects during Annealing Cho, J. Y., Lee, H. J., Kim, H., Szpunar, J. A. Trans Tech Publications
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