Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

著者名:

掲載資料名:

Eco-materials processing & design VI : proceedings of the 6th International Symposium on Eco-Materials Processing & Design, January 16-18, 2005, Jinju, Korea

シリーズ名:

Materials science forum

シリーズ巻号:

486-487

発行年:

2005

開始ページ:

289

終了ページ:

292

総ページ数:

4

出版情報:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499663 [0878499660]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014243
シリーズID:	PA00000012
会議名:	International Symposium on Eco-Materials Processing & Design : ISEPD
回次:	6th
会議開催地:	Jinju, Korea
会議開催年:	2005.01.16-2005.01.18

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