The Thermal Annealing Effect on the Residual Stress and Mechanical Property in the Compressive Stressed DLC Film

The Thermal Annealing Effect on the Residual Stress and Mechanical Property in the Compressive Stressed DLC Film

著者名:

掲載資料名:

PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, China

シリーズ名:

Materials science forum

シリーズ巻号:

475-479(5)

発行年:

2005

開始ページ:

3619

終了ページ:

3622

総ページ数:

4

出版情報:

Uetikon-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499601 [0878499601]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014239
シリーズID:	PA00000012
会議名:	PRICM : Pacific Rim International Conference on Advanced Materials and Processing
回次:	5th
会議開催地:	Beijing, China
会議開催年:	2004.11.02-2004.11.05

類似資料:

1 国際会議録 The Thermal Annealing Effect on the Residual Stress and Interface Adhesion in the Compressive Stressed DLC Film Choi, Heon Woong, Moon, Myoung-Woon, Kim, Tae-Young, Lee, Kwang-Ryeol, Oh, Kyu Hwan Materials Research Society	7 国際会議録 Mechanical and Thermal Properties of Silicon Nitride Hot Pressed with Adding Rare-Earth Oxides Choi, D. H., Moon, B. K., Sung, R. J., Kim, S. H., Niihara, K. Trans Tech Publications
2 国際会議録 The Evaluation of the Elastic Property in Nano-Scaled Thin Compressive Film on Patterned Substrates Moon, M. W., Kim, Y. Y., Lee, K. R., Oh, K. H. Trans Tech Publications	8 国際会議録 Effect of Thermal Spray Processing Techniques on the Microstructure and Properties of Ni-Based Amorphous Coatings Lee, S. M., Moon, B. M., Fleury, E., Ahn, H. S., Kim, D. H., Kim, W. T., Sordelet, D. J. Trans Tech Publications
3 国際会議録 The Evaluation of Adhesion Energy in Thin Compressively Stressed Film by Using Delamination Buckle and Freehanging Buckle Oh, K. H., Moon, M. W., Lee, K. R. Trans Tech Publications	9 国際会議録 Effect of Residual Stress on Mechanical Property of Monolithic Bulk Metallic Glass M.H. Lee, J.H. Jun, J. Eckert Trans Tech Publications
4 国際会議録 The Characteristics of Hot-Carrier Stressed Bottom-Gate Polycrystalline Silicon Thin-Film Transistors Employing Alternating Magnetic-Field-Enhanced Rapid … W. Lee, H. Shin, K. Cho, J. Choi, C. Kim Electrochemical Society	10 国際会議録 The Influence of the Substrate on the Mechanical Properties of Si-Doped DLC Thin Films C.W. Moura e Silva, J.R.T. Branco, M.C. Oliveira, J.M. Antunes, A. Cavaleiro Trans Tech Publications
5 国際会議録 Residual Stress, Mechanical Behavior and Electrical Properties of Cu/Nb Thin-Film Multilayers Griffin, A. J., Jr., Embury, J. D., Hundley, M. F., Jervis, T. R., Kung, H. H., Scarborough, W. K., Walter, K. C., Wood, … MRS - Materials Research Society	11 国際会議録 The Mechanical Properties of TiN Films Grown by a Pure N₂ Plasma Sputtering B.S. Jang, C.H. Lee, J.W. Choi, J.S. Kwon, H.K. Kim, C.H. Park, H.M. Kim Trans Tech Publications
6 国際会議録 Effect of Buried Oxide on Reliability of Thin-Film SOI nMOSFETs Kim, H-K, Lee, J-W, Lee, W-H, Oh, M-R, Koh, Y-H Electrochemical Society	12 国際会議録 Thermal stress analysis of a circular holed specimen W. T. Kim, M. Y. Choi, J. H. Park, K. S. Kang Society of Photo-optical Instrumentation Engineers

1

2

3

4

5

6

7

8

9

10

11

12