Application of Semi-Solid Forming to 2024 and 7075 Wrought Aluminum Billets Fabricated by the EMC Process

Application of Semi-Solid Forming to 2024 and 7075 Wrought Aluminum Billets Fabricated by the EMC Process

著者名:

掲載資料名:

Solidification and gravity 2000

シリーズ名:

Materials science forum

シリーズ巻号:

329-330

発行年:

2000

開始ページ:

487

終了ページ:

492

総ページ数:

6

出版情報:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878498529 [0878498524]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014222
シリーズID:	PA00000012
会議名:	International Conference on Solidification and Gravity
回次:	3rd
会議開催地:	Miskolc, Hungary
会議開催年:	1999.04.25-1999.04.28

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