Fundamental Study of Iodine and Iodine Based Slurries for Copper CMP
- 著者名:
- 掲載資料名:
- Chemical mechanical polishing 2000 -- fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 613
- 発行年:
- 2001
- 開始ページ:
- E7.8
- 出版情報:
- Warrendale, PA: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558995215 [1558995218]
- 言語:
- 英語
- 請求記号:
- M23500/613
- 資料種別:
- 国際会議録
類似資料:
Electrochemical Society |
7
国際会議録
Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy
Electrochemical Society |
Materials Research Society |
Materials Research Society |
Electrochemical Society |
Electrochemical Society |
Materials Research Society |
10
国際会議録
Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents
Materials Research Society |
Materials Research Society |
Electrochemical Society |
Materials Research Society |
Materials Research Society |