Fabrication And Performance Limits Of Sub-0.1 μm Cu Interconnects

Fabrication And Performance Limits Of Sub-0.1 μm Cu Interconnects

著者名:

Kuan, T.

掲載資料名:

Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

612

発行年:

2001

開始ページ:

D7.1

出版情報:

Warrendale, PA: Materials Research Society

ISSN:

02729172

ISBN:

9781558995208 [155899520X]

言語:

英語

請求記号:

M23500/612

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014200
シリーズID:	PA00000011
会議名:	Symposium on materials, technology and reliability for advanced interconnects and low-k dielectrics
回次:	2000
会議開催地:	San Francisco, CA, USA
会議開催年:	2000.04.23-2000.04.27

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