Electromigration Characterization Versus Texture Analysis In Damascene Copper Interconnects

Electromigration Characterization Versus Texture Analysis In Damascene Copper Interconnects

著者名:

掲載資料名:

Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

612

発行年:

2001

開始ページ:

D2.4

出版情報:

Warrendale, PA: Materials Research Society

ISSN:

02729172

ISBN:

9781558995208 [155899520X]

言語:

英語

請求記号:

M23500/612

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014200
シリーズID:	PA00000011
会議名:	Symposium on materials, technology and reliability for advanced interconnects and low-k dielectrics
回次:	2000
会議開催地:	San Francisco, CA, USA
会議開催年:	2000.04.23-2000.04.27

類似資料:

1 国際会議録 X-Ray Diffraction Determination of Residual Stresses in Narrow Copper Interconnects with Submicronic Widths Sicardy, O., Touet, I., Arnaud, L., Charlet, F., Berger, T. Trans Tech Publications	7 国際会議録 Copper Versus Magnesium as an Alloying Element in Aluminum Interconnects: Effects on Electromigration Spolenak, R., Mason, J., Kraft, O., Arzt, E. MRS - Materials Research Society
2 国際会議録 Analysis of Electromigration in Dual-Damascene Interconnect Structures R. Lacerda de Orio, S. Carniello, H. Ceric, S. Selberherr Electrochemical Society	8 国際会議録 X-ray Diffraction Determination of Texture and Stress in Damascene Fabricated Copper Interconnects Winter, D., Besser, P. R. MRS - Materials Research Society
3 国際会議録 Electroplated Damascene Copper: Process Influences on Recrystallization and Texture Gross, M. E., Drese, R., Lingk, C., Brown, W. L., Evans-Lutterodt, K., Barr, D., Golovin, D., Ritzdorf, T., Turner, J., … MRS - Materials Research Society	9 国際会議録 Self-Annealing Textures of Copper Damascene Interconnects Lee, D. N., Lee, H. J. Trans Tech Publications
4 国際会議録 Electroplated Damascene Copper: Process Influences on Recrystallization and Texture Barr, D., Brown, W. L., Drese, R., Evans-Lutterodt, K., Golovin, D., Graham, L., Gross, M. E., Lingk, C., Ritzdorf, T., … Materials Research Society	10 国際会議録 Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect Trees Gan, C. L., Thompson, C. V., Pey, K. L., Choi, W. K., Chang, C. W., Guo, Q. Materials Research Society
5 国際会議録 Microstructure and Texture of Electroplated Copper in Damascene Structures Gross, M. E., Lingk, C., Siegrist, T., Coleman, E., Brown, W. L., Ueno, K., Tsuchiya, Y., Itoh, N., Ritzdorf, T., … MRS - Materials Research Society	11 国際会議録 Experimental Characterization Of The Reliability Of 3-Terminal Dual-Damascene Copper Interconnect Trees Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K., Wei, F., Yu, B., Hau-Riege, S.P. Materials Research Society
6 国際会議録 Texture Investigations In Damascene Copper Interconnects Mirpuri, K., Szpunar, J.A., Kozaczek, K. Trans Tech Publications	12 国際会議録 The Microstructure and Electromigration Performance of Damascene-Fabricated Aluminum Interconnects Besser, Paul R., Sanchez, John E., Jr., Field, David P., Pramanick, Shekhar, Sahota, Kashmir MRS - Materials Research Society

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