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A Quantitative Study Of The Adhesion Between Copper, Barrier And Organic Low-k Materials

著者名:
Lanckmans, F.
Brongersma, S.
Varga, I.
Bender, H.
Beyne, E.
Maex, K.
さらに 1 件
掲載資料名:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
612
発行年:
2001
開始ページ:
D1.4
出版情報:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995208 [155899520X]
言語:
英語
請求記号:
M23500/612
資料種別:
国際会議録

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