Integration Challenges of Inorganic Low-K (K < 2.5) Materials With Cu for Sub-0.25)μm Multilevel Interconnects

Integration Challenges of Inorganic Low-K (K < 2.5) Materials With Cu for Sub-0.25)μm Multilevel Interconnects

著者名:

掲載資料名:

Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

565

発行年:

1999

開始ページ:

151

終了ページ:

160

総ページ数:

10

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558994720 [1558994726]

言語:

英語

請求記号:

M23500/565

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014191
シリーズID:	PA00000011
会議名:	Symposium on low-dielectric constant materials
回次:	5th
会議開催地:	San Francisco, CA, USA
会議開催年:	1999.04.05-1999.04.08

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