Process-structure-property interrelationships of copper for electronic applications
- 著者名:
Woodman, A.S. Taylor, E.J. Anderson, E.B. Weil, R. Hong, S. Knapke, D.H. Fisher, G.L. - 掲載資料名:
- Proceedings of the Second International Symposium on Electrochemical Technology Applications in Electronics
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 1993-20
- 発行年:
- 1993
- 開始ページ:
- 86
- 終了ページ:
- 98
- 総ページ数:
- 13
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566770620 [1566770629]
- 言語:
- 英語
- 請求記号:
- E23400/932472
- 資料種別:
- 国際会議録
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