ADHESION AND REMOVAL OF SILICA AND ALUMINA SLURRY PARTICLES DURING Cu CMP PROCESS

ADHESION AND REMOVAL OF SILICA AND ALUMINA SLURRY PARTICLES DURING Cu CMP PROCESS

著者名:

掲載資料名:

Cleaning technology in semiconductor device manufacturing VIII : proceedings of the international symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2003-26

発行年:

2003

開始ページ:

312

終了ページ:

320

総ページ数:

9

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774116 [156677411X]

言語:

英語

請求記号:

E23400/200326

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014088
シリーズID:	PA00000028
会議名:	International Symposium on Cleaning Technology in Semiconductor Device Manufacturing ; Fall Meeting of the Electrochemical Society
回次:	8th ; 2003
会議開催地:	Orlando, Florida, USA
会議開催年:	2003.10.00

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6 国際会議録 Frictional Behavior and Particle Adhesion of Abrasive Particles during Cu CMP Hong, Yi-Koan, Han, Ja-Hyung, Song, Jae-Hoon, Park, Jin-Goo Materials Research Society	12 国際会議録 Evaluation of Commercialized Slurries and Pads for Polymer CMP (Chemical Mechanical Polishing) Zhang, F., Wake, R.W., Cook, L., Busnaina, A.A. Electrochemical Society

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