Electrochemical Characterization of Copper and Tantalum Chemical Mechanical Planarization

Electrochemical Characterization of Copper and Tantalum Chemical Mechanical Planarization

著者名:

掲載資料名:

Chemical Mechanical Planarization : proceedings of the International Symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2003-21

発行年:

2003

開始ページ:

245

終了ページ:

256

総ページ数:

12

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774048 [1566774047]

言語:

英語

請求記号:

E23400/200321

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014084
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
回次:	6th ; 204th
会議開催地:	Orlando, FL, USA
会議開催年:	2003.10.12-2003.10.17

類似資料:

1 国際会議録 Copper CMP Formulation for 65 nm Device Planarization Stauf, Gregory T., Boggs, Karl, Wrschka, Peter, Ragaglia, Craig, Darsillo, Michael, Roeder, Jeffrey F., King, Mackenzie, … Materials Research Society	7 国際会議録 Electrochemical Interactions during the Chemical Mechanical Planarization of Copper in Ammonia Based Slurries Sainio, C.A., Duquette, D.J. Electrochemical Society
2 国際会議録 Electrochemical Characterization of Copper in Ammonia-containing Slurries for Chemical Mechanical Planarization of Interconnects Sainio, C., Duquette, D.J. Electrochemical Society	8 国際会議録 Copper Nucleation on Platinum in the Presence of Additives in Acid Copper Solution Han, J., King, M., Stawasz, M., Baum, T. Electrochemical Society
3 国際会議録 Selectivity Studies on Tantalum Barrier Layer for Copper Chemical Mechanical Planarization Vijayakumar, A., Du, T., Sundaram, K.B., Desai, V. Electrochemical Society	9 国際会議録 Effect of Organic Amine in Colloidal Silica Slurry on Polishing-rate Selectivity of Copper to Tantalum-nitride Film in Copper Chemical Mechanical Planarization J. Park, H. Cui, H. Hwang, U. Paik, H. Park Electrochemical Society
4 国際会議録 Electrochemical Considerations During Chemical-Mechanical Planarization of Copper Sainio, C., Diquette, D.J. Electrochemical Society	10 国際会議録 Development of Electrochemical Mechanical Polishing for Advanced Copper Planarization R. Jia, Y. Wang, Z. Wang, S. Tsai, J. Dma, D. Mao, L. Karuppiah, L. Chen Electrochemical Society
5 国際会議録 Copper Chemical Mechanical Planarization Processes in Carbon Dioxide Denison, G.M., Visintin, P.M., DeSimone, J.M., Bessel, C. Electrochemical Society	11 国際会議録 Chemical-Mechanical Planarization Issues in Patterning Copper and Aluminum Interconnects with Magnetic Liners Gutmann, Ronald J., Wang, Bin, Lee, Byung-Chan, Paul Chow, T., Duquette, David J. Electrochemical Society
6 国際会議録 An Electrochemical Mechanism of Copper Removal During Chemical Mechanical Planarization Sainio, Carlyn, Duquette, David J. Electrochemical Society	12 国際会議録 Controlling Scratching in Cu Chemical-Mechanical Planarization (CuCMP) T. Eusner, N. Saka, J. Chun, S. Armini, M. Moinpour Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12