Optimization by Concentration of Oxidizer and Complexing Agent in Cu CMP Slurry

Optimization by Concentration of Oxidizer and Complexing Agent in Cu CMP Slurry

著者名:

掲載資料名:

Chemical Mechanical Planarization : proceedings of the International Symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2003-21

発行年:

2003

開始ページ:

120

終了ページ:

125

総ページ数:

6

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774048 [1566774047]

言語:

英語

請求記号:

E23400/200321

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014084
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
回次:	6th ; 204th
会議開催地:	Orlando, FL, USA
会議開催年:	2003.10.12-2003.10.17

類似資料:

1 国際会議録 The Roles of Complexing Agents on Copper CMP Lim, G., Kim, T.E., Lee, J.-H., Kim, I., Lee, H-W. Electrochemical Society	7 国際会議録 Post-CMP Cleaning: Slurry-Induced Metallic Contaminations on Undoped and Doped Silicate Oxide Surfaces Han, S.H., Kim, S.-y., Ahn, H.-g., Kim, H.-j., Kim, J.-h., Lee, J.-g., Ko, C.-g. Electrochemical Society
2 国際会議録 Mechanochemical Synthesis of Nano-Sized CeO2 and its Application for CMP Slurry Lim, G., Lee, J.H., Kim, J.S., Lee, H.W., Hyun, S.H. Trans Tech Publications	8 国際会議録 Role of Molecular Structure of Complexing/Chelating Agents in Copper CMP Slurries Patri, Udaya B., Pandija, S., Babu, S.V. Materials Research Society
3 国際会議録 Effect of Oxidizer on Copper And Tantalum in Copper CMP Lee, D.-W., Kim, N.-H., Kim, S.-Y., Kim, T.-H., Chang, E.-G. Electrochemical Society	9 国際会議録 Effect of Tin on the Microstructures and Mechanical Properties ofa Au-Pt-Cu Alloy Kim, M.H., Lee, S.H., Lim, H.N., Doh, J.M., Baik, H.G. Trans Tech Publications
4 国際会議録 Electrochemical and Frictional Behaviors of Cu Surface in Organic Acid Based Slurries During Copper CMP Eom, D.-H., Ryu, J.-S., Hong, Y.-K., Myung, J.-J., Kim, K.-S., Park, J.-G. Electrochemical Society	10 国際会議録 Glycerol-Based Slurry for Polyimide CMP Permana, D., Murarka, S.P., Lee, M.G., Beilin, S.I. Electrochemical Society
5 国際会議録 The Effect of Additives in Cu CMP Slurry on Cu Polishing Hong, Y.-K., Eom, D.-H., Park, J.-G. Electrochemical Society	11 国際会議録 Evaluation of Barrier CMP Slurries and Characterization of ULK Material Properties Shifts Due to CMP W. Tseng, D. Kioussis, S.L. Manikonda, H. Kim, J. Choi Electrochemical Society
6 国際会議録 Passivation and Etching Behaviors of Copper Surface in Copper CMP Slurries Eom, D.-H., Hong, Y.-K., Lee, S.-H., Park, J.-Y., Myung, J.-J., Park, J.-G., Kim, K.-S., Song, H.-S., Park, H.-S., Choi, … Electrochemical Society	12 国際会議録 Effect of Oxidizing Agent of Polypyrrole Layer Prepared by Vapor Polymerization Cho, J. H., Kim, J. S., Yu, J. B., Sohn, S. O., Huh, J. S. Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12