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Electrochemical and Frictional Behaviors of Cu Surface in Organic Acid Based Slurries During Copper CMP

著者名:
Eom, D.-H.
Ryu, J.-S.
Hong, Y.-K.
Myung, J.-J.
Kim, K.-S.
Park, J.-G.
さらに 1 件
掲載資料名:
Chemical Mechanical Planarization : proceedings of the International Symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2003-21
発行年:
2003
開始ページ:
44
終了ページ:
51
総ページ数:
8
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774048 [1566774047]
言語:
英語
請求記号:
E23400/200321
資料種別:
国際会議録

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