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Fusion-Bonded Multilayered SOI for MEMS Applications

著者名:
Somasundram, K.
McCann, P.
Cole, D.
McNamara, C.
Boyle, A.
Devine, C.
Brown, A.
Nevin, A.
さらに 3 件
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2003-19
発行年:
2003
開始ページ:
288
終了ページ:
300
総ページ数:
13
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774024 [1566774020]
言語:
英語
請求記号:
E23400/200319
資料種別:
国際会議録

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