Porous SiOCH Modification Studies Induced by Ashing Processes

Porous SiOCH Modification Studies Induced by Ashing Processes

著者名:

掲載資料名:

Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2003-13

発行年:

2003

開始ページ:

66

終了ページ:

72

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773935 [1566773938]

言語:

英語

請求記号:

E23400/200313

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014077
シリーズID:	PA00000028
会議名:	International Symposium on Thin Film Materials, Processes, and Reliability ; Meeting of the Electrochemical Society
回次:	2003 ; 203rd
会議開催地:	Paris, France
会議開催年:	2003.04.27-2003.05.02

類似資料:

1 国際会議録 Etching of Low-k Interconnect Materials for Next Generation Devices Chevolleau, T., Joubert, O., Posseme, N., Valuer, L., Thomas-Boutherin, I. Electrochemical Society	7 国際会議録 Process optimization of a negative-tone CVD photoresist for 193-nm lithography applications Joubert, O. P., Fuard, D., Monget, C., Schiavone, P., Toublan, O., Prola, A., Temerson, J. M., Inglebert, R. L., … SPIE - The International Society of Optical Engineering
2 国際会議録 Resist Transformation during Etching Steps Involved in Patterning Low-k Dielectric Materials: Impact on Process Control Pargon, E., Joubert, O., Posseme, N, Valuer, L. Electrochemical Society	8 国際会議録 STUDY OF ION BOMBARDMENT-INDUCED SUBSURFACE COMPOSITIONAL MODIFICATIONS IN Ni-Cu ALLOYS AT ELEVATED TEMPERATURES BY ION SCATTERING SPECTROSCOPY Lam, N. Q., Hoff, H. A., Wiedersich, H., Rehn, L. E. North-Holland
3 国際会議録 TEM Study of Porous Silicon Fabricated from n- and p-Type-Doped Polycrystalline Films Haji, L., Thomas, Y. Le, Lai, F. Chane Che, Joubert, P. MRS - Materials Research Society	9 国際会議録 Control over wettability via surface modification of porous gradients Y. L. Khung, M. A, Cole, S. J. P. Mclnnes, N. H. Voelcker Society of Photo-optical Instrumentation Engineers
4 国際会議録 Novel Process for Surface Modification of Polyimide Somasiri, N. L. D., Speckhard, T. A., Zenner, R. L. D. American Chemical Society	10 国際会議録 ETCHING OF SILICON NATIVE OXIDE USING ULTR-SLOW MULTICHARGED Arq+ IONS Le Roux, V., Machicoane, G., Borsoni, G., Korwin-Pawlowski, M., Bechu, N., Kerdiles, S., Laffitte, R., Valuer, L., … Electrochemical Society
5 国際会議録 All Dry CVD-Based Resist for Advanced Lithography Processes Monget, C., Joubert, O., Vallier, L., Weidman, T.W. Electrochemical Society	11 国際会議録 Porous Silicon as a Sacrificial Material for Micromachining of Silicon Optical Platforms Guendouz, M., Joubert, P., Pedrono, N., Rouzic, J. Le MRS - Materials Research Society
6 国際会議録 Study of the Technical Capability of Sugarcane Bagasse Ash in Concrete Production T. da Cruz Sessa, M.M. Silvoso, E.G. Vazquez, E.L. Qualharini, A.N. Haddad Trans Tech Publications	12 国際会議録 Interaction of O and H Atoms with low-k SiOCH films pretreated in He plasma Mikhail R. Baklanov, O.V. Braginsky, A.S. Kovalev, D.V. Lopaev, Y.M. Mankelevich, T.V. Rakhimova, E.M. Malykhin, O.V. … Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12